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Gloway 16GB DDR4 2666 Desktop RAM Tianze II Heat Spreader Selected Chips CL19 Light Feather White Intel Dedicated AI Computer Memory Module
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Gloway•memory

Gloway 16GB DDR4 2666 Desktop RAM Tianze II Heat Spreader Selected Chips CL19 Light Feather White Intel Dedicated AI Computer Memory Module

CNÂĄ429.00
SKU: 100025295854
Status:In Stock (16)
ID: 100025295854
Weight: 60.00 g
Dims:169x56x10 mm

Specifications

Amount of memory
1 piece
Total capacity
8GB
Platform
desktop computer memory
Memory frequency
3200MHz
Appearance characteristics
vest strap
DDR algebra
DDR4

Variants / Sale Attributes

Memory frequency: 3200 C18 Tiance Bright Moon White Selected Granules
Number of memory sticks and total capacity: 8GB, 1 piece

Package Contents

Memory module *1, packaging box *1;

Product Description

Product Specifications

Overview

Brand
Gloway
Memory Types
DDR3 / DDR4 Desktop RAM

Tianze Series

  • Tianze Flagship: High-end heat spreader module
  • Tianze-Yi: High-performance heat spreader module
  • Hanjian: Cost-effective heat spreader module

Additional details

Single Module
8GB / 16GB / 32GB (Tianze Flagship)
Single Module
8GB / 16GB (Tianze-Yi)
Single Module
8GB / 16GB (Hanjian)

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Kit Capacity

ItemDetail
Tianze Flagship16GB / 32GB / 64GB (single or dual kits)
Tianze-Yi16GB / 32GB (single or dual kits)
HanjianNo kits available, single modules only

Additional details

Tianze Flagship
3200 / 3600
Tianze-Yi
3200 / 3600
Hanjian
2666
Tianze Flagship
CL18
Tianze-Yi
CL16 / CL18
Hanjian
CL19
Tianze Flagship
1.35V
Tianze-Yi
1.35V / 1.45V
Hanjian
1.2V
Tianze Flagship
138 Ă— 8 Ă— 40
Tianze-Yi
138 Ă— 8 Ă— 40
Hanjian
137 Ă— 7 Ă— 34
Tianze 1st Gen
High-performance RGB modules
Zhanjiang
High-performance standard modules
Benpu
Cost-effective standard modules
Tianze 1st Gen
8GB / 16GB (single modules)
Zhanjiang
4GB / 8GB / 16GB (single modules)
Benpu
8GB / 16GB (single modules)
Tianze 1st Gen
3200 / 3600
Zhanjiang
1600 / 2666
Benpu
3200
Tianze 1st Gen
CL18
Zhanjiang
CL11 / CL19
Benpu
CL18
Tianze 1st Gen
1.35V
Zhanjiang
1.2V / 1.5V
Benpu
1.35V
Tianze 1st Gen
138 Ă— 7.3 Ă— 37.6
Zhanjiang
137.5 Ă— 2.5 Ă— 32
Benpu
137.5 Ă— 2.5 Ă— 32

Robust build quality for stable long-term operation in intensive computing environments

Advanced 3D heat dissipation with integrated stamped aluminum heat spreader (1.0mm thick)

Trendy appearance with enhanced heat conduction to reduce chip temperature and improve stability

XMP 2.0 support for stable overclocking (requires motherboard support)

8-layer PCB with high-quality memory chips and optimized signal transmission design

Compatible with major Intel and AMD platforms, supporting multi-threaded and multi-task workloads

Strict quality control and testing to ensure reliability and performance

1. Open the computer case and locate the memory slots; discharge static electricity and clean dust from slots.

2. Open the memory slot clips outward; for dual modules, install in slots 2 and 4 first.

3. Align the memory module’s notch with the slot’s key to avoid incorrect installation.

4. Press down firmly until a “click” sound is heard and clips snap back to secure the module.

5. To remove, press both clips outward to eject the memory module.

Specifications may vary by model; please refer to the actual product for final details.

Consult your motherboard manufacturer for XMP configuration support and instructions.

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