Llano Phase Change Thermal Paste, Cooling Silicone Pad for Laptop CPU And Graphics Card, Thermal Conductivity 13.8 (W/m·K)

Key Features

1. Major upgrade from previous version

2. Temperature reduction of more than 20 degrees

3. Long-lasting phase change silicone grease

4. Multi-dimensional upgrade

5. Easy to tear, durable, high thermal conductivity

6. Resistant to cracking, ensuring safety

7. Improved toughness and uniform filling of gaps

8. Utilizes unique phase change materials and submicron alumina spheres

9. Enhanced thermal performance surpassing industry standards

10. Improved material quality and thickness for better tear resistance and durability

Technical Details

Utilizes phase change materials and submicron alumina spheres

Maintains solid state at room temperature, softening with heat to fill gaps effectively

Ensures better heat dissipation and cooling efficiency

Restores solid state upon cooling, ensuring long-term reliability

10x density enhancement with submicron alumina and GLASSINE release paper

Temperature reduction of 3.5°C compared to previous version

Durability and Performance

Withstands 30-minute high-temperature test at 280°C without evaporation

Long lifespan, eliminating frequent replacements

Precise cutting to prevent overflow when softened by heat

Improved thickness of 0.25mm for enhanced durability and tear resistance

Product Parameters