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MAXSUN MS-Challenger H610M-R Gaming Motherboard DDR4 Support CPU 12100/13100/12400F (Intel H610/LGA 1700)
MAXSUN‱motherboard

MAXSUN MS-Challenger H610M-R Gaming Motherboard DDR4 Support CPU 12100/13100/12400F (Intel H610/LGA 1700)

CN„429.00
SKU: 100051513368
Status:Out of Stock
ID: 100148897137
Weight: 750.00 g
Dims:235x456x35 mm

Specifications

SSD solid state drive interface
M.2 interface (NVMe protocol)
Board type
M-ATX (Compact)
AMD chip
Not supported
Support PCIe protocol
Supports PCIE 4.0
Wi-Fi Connection
Wi-Fi connection not supported
Compatible CPU interface
INTEL LGA1700
INTEL chip
H610
PCI Express x8
0 pcs

Variants / Sale Attributes

model: [Challenger] H610MR

Package Contents

Motherboard *1; Warranty card *1; SATA data cable *2; M.2 screw *1; Antenna *1

Product Description

Product Specifications

Overview

Brand
MAXSUN
Model
Challenger H610 M-R
CPU Socket
LGA1700 (Supports Intel 12th and 13th Gen processors)
Chipset
Intel H610
Form Factor
mATX (22.5 x 19.5 cm)

Low-temperature MOSFETs

4 (Vcore) + 1 (VCC_GT) + 1 (VCC_AUX) phase stable power delivery

8-pin reinforced CPU power connector for enhanced power stability

MaxPower enhanced power supply technology

Dual channel DDR4 memory slots (2 slots)

Dual filter memory wiring for optimized signal environment and stability

1 x PCIe 4.0 x16 slot

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1 x PCIe 4.0 x1 slot

1 x M.2 PCIe 3.0 x4 slot (supports 2280/2240 form factors)

3 x SATA 3.0 6Gb/s ports

1 x HDMI port

1 x VGA port

(Supports integrated graphics dual display output)

Additional details

Rear I/O
2 x USB 3.2 Gen1 ports, 4 x USB 2.0 ports
Front panel headers
1 x USB 3.2 Gen1 header, 1 x USB 2.0 header

High-definition audio codec

Gigabit Ethernet LAN

2 x 4-pin fan headers

Customized ESP electrostatic protection on I/O

Austenitic stainless steel reinforced anti-corrosion and moisture protection for durable interfaces

Distributed debug LEDs for CPU, DRAM, VGA, and BOOT to assist in quick and accurate troubleshooting

Full-speed PCIe 3.0 x4 M.2 interface for NVMe SSDs, enabling faster and smoother boot times

Stable and optimized power delivery with low-temperature MOSFETs and reinforced connectors

Balanced and comprehensive design for reliable long-term use in harsh environments

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