- Safety
- Electrically insulated, heat resistant, prevents hardening
- Compatibility
- Widely used for solid state drives, north and south bridge chips, LED lighting, automotive electronics, power supplies, NVMe, laptops
- Specifications
- Thickness of 1.5/2 mm, dimensions of 84×48 mm and 70×22 mm, temperature resistance of -40~200℃
- Installation
- Clean the device, cut the pad to size, peel off protective film, apply and press firmly
- Characteristics
- Insulation, thermal conduction, pressure resistance, self-adhesive, soft and slightly sticky, easy to cut
- Installation Steps
- Clean surfaces, cut pad to size, apply to chip, press heatsink on top, apply pressure
- Precautions
- Tighten heatsink screws, allow machine to run for optimal effect, replace pad if re-opening
- Manufacturer
- Henan Liangpu Electronic Technology Co., Ltd.
- Standard
- Q/LPDZ004-2019
- Customer Service
- 400-750-7501
- Website
- www.i-nvv.com
- Address
- Building 35, Liandong U Valley International Enterprise Port, Zhengzhou City, Henan Province, China