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KELEPU Thermal Silicone Grease, Heat Dissipation Silicone Grease, Thermal Paste for Laptop CPU Graphics Card Mobile Phone Chip, 2g Package, Thermal Conductivity 11.8 (W/m.K)
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KELEPU•computer hardware components

KELEPU Thermal Silicone Grease, Heat Dissipation Silicone Grease, Thermal Paste for Laptop CPU Graphics Card Mobile Phone Chip, 2g Package, Thermal Conductivity 11.8 (W/m.K)

CNÂ¥10.94
SKU: 100111759627
Status:Out of Stock
ID: 100111759627
Weight: 20.00 g
Dims:178x85x8 mm

Specifications

Category
Other accessories
For Use With
Other

Variants / Sale Attributes

Color: [Super Value] Thermal Conductivity 11.8W/2g

Package Contents

Kelepu thermal conductive silicone grease, suitable for notebook computer CPU, graphics card, mobile phone chip, 2g pack with a thermal conductivity of 11.8 (w/m.k).

Product Description

Overview

Brand
KELEPU
Product Name
Thermal Grease
Thermal Resistance
0.112C-in²/W
Operating Temperature
-50°C to 250°C
Density
3.0 g/ml
Insulation Strength
10Kv/mm
Package Includes
Thermal Grease, Transparent Scraper
Thermal Conductivity
11.8 (w/m.k)

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Application Range
Laptop devices, high-heat CPUs, desktop computers, workstations, industrial computers, and performance gaming rigs
Dimensions
23 mm x 11 mm x 3 mm
Additional Information
Thermal Grease, THERMALGREASE, 110 mm
Usage Instructions
Clean the surface of the CPU, apply an appropriate amount of thermal grease using a cross or dot method, spread the thermal grease evenly with a scraper or brush, ensuring a thin layer without impurities or air bubbles
Caution
Thicker layers of thermal grease may affect heat conduction efficiency, store in a dry, cool place away from sunlight and moisture, shelf life of 12 months at 25°C, stir well if any silicone oil precipitation occurs during storage
Safety Precautions
Avoid skin contact, rinse with water if contact occurs, seek medical attention if contact with eyes, harmless for transportation with general chemical products
Choose KELEPU for three main reasons
unique source, safety for computers, rapid cooling, stable heat conduction.
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