Masentek Phone Heat Dissipation Board, Cooling Pad, Superconducting Silicone Adhesive Cooling Device, Semiconductor Heat Spreader, Suitable for Apple And Android Phones, Thermal Conductive Plate AI

Multiple styles available

Requires use with a cooling fan

Immediate purchase available

Phone heat sink plate for accelerated cooling and uniform heat dissipation, increasing heat dissipation area and cooling speed

Strong adhesive for secure attachment, preventing detachment

Compatible with cooling fans for quick phone cooling, larger and more uniform heat dissipation area

Embedded magnetic sheet for tight fit and enhanced cooling effect

Aluminum heat conduction plate and thermal grease for effective heat dissipation

Ultra-thin design, approximately 1mm thick and lightweight at 15g

Please check phone model and dimensions before purchase to ensure compatibility, especially the camera position