COXBYTE Phase Change Silicone Pad (CPU/GPU Cooling), TPK-30 Gaming Laptop Graphics Card Core Dedicated Cooling Thermal Patch, 31*50mm

COXBYTE•radiator

COXBYTE Phase Change Silicone Pad (CPU/GPU Cooling), TPK-30 Gaming Laptop Graphics Card Core Dedicated Cooling Thermal Patch, 31*50mm

CN¥29.90

SKU: 100119315201

Status:In Stock (10)

ID: 100119315201

Weight: 80.00 g

Dims:156x133x18 mm

Specifications

Number of heat pipes: No
Type: Thermal grease
Lighting Effects: No light

Variants / Sale Attributes

Color: 31*50*0.25mm [For Refrigeration Use]

Package Contents

Phase change pad *1 Disassembly tool kit *1 Instruction manual *1

Product Description

Overview

Brand: COXBYTE
Model: ThermalSolutions TPK-30
Description: High-energy flagship thermal paste for CPU/GPU, featuring phase-change silicon grease film that is easy to tear and apply, durable, and safe. With a 4-6 core advantage, enhanced with submicron alumina for 10x increased density and GLASSINE release paper for improved texture and tear resistance. The 0.25 mm gold thickness and new composite phase-change material provide superior performance compared to industry standards.
1. 2nd Channel: At room temperature, the phase-change silicon grease film remains solid. The high thermal conductivity phase-change silicon grease film contains unique phase-change materials and submicron alumina spheres. As the temperature rises, the film becomes softer, better filling gaps to dissipate heat more effectively into the heat sink, achieving better heat dissipation and maintaining device performance. Upon cooling, it solidifies again, maintaining the integrity of the polymer matrix for long-term reliability.

Similar Products

Out of Stock

thermalrightradiator

Thermalright Assassin Spirit 120 VISION ARGB BLACK CPU Air Cooler AS120 VISION ARGB BLACK

AS120 VISION ARGB Black

CN¥129.90

View

In Stock

SAMAradiator

SAMA Second Generation XW360-PLUS Fanless Black All-In 360 Water Cooling CPU Cooler (2.8-Inch Large Round LCD Display)

2.8-Inch Screen, Second-Generation XW360-P Fanless, Black

CN¥529.00

View

2. 3rd Channel

At 50°C phase-change thermal conductivity, the material flows when the chip temperature exceeds 50°C and returns to its solid state when the temperature drops below 50°C, continuously carrying away heat during the phase-change process.

Material Selection

Organic silicon materials from a global leader in the field are used to create a new composite phase-change pad, reducing chip temperatures by 3.5°C compared to previous versions. Selected for fine and uniform texture, eliminating rough particles.

Additional Features

Precision cutting ensures the silicon grease film softens evenly when heated, providing comprehensive and precise coverage without overflowing.
Upgraded GLASSINE release paper maintains the moisture of the silicon grease film, preventing sticking and ensuring easy separation.
GLASSINE release paper is a type of industrial paper treated with coatings to enhance properties such as high temperature resistance, moisture resistance, and oil resistance, providing good internal strength, transparency, and durability.

Durability and Performance

Endures high temperatures up to 280°C during a 30-minute baking test, showcasing high-quality, fine materials and strong structural stability.
Long-lasting and evaporates resistant, ensuring extended service life even under low temperatures.

1. Clean the CPU surface and heat sink base with the included cleaning kit.

2. Cut the silicon grease film to fit the CPU size.

3. Peel off one side of the release paper and apply the film to the CPU surface.

4. Press the film evenly with your thumb and remove the other half of the release paper before use.

Product Details

Item	Detail
Product Name	TPK-30
Thermal Impedance	0.04°C.cm²/w
Size	As per options
Thickness	0.25 mm
Operating Temperature	-40°C to +200°C
Conductivity	Non-conductive
Applications	Suitable for use with CPU/GPU/MCU.