NVV Graphene Heat Sink, Phone Cooling Pad, High-Nano Copper Foil Even Heat Plate, Phone Assembly And Computer Motherboard Cooling Device, 100*200mm, NZ-G7C

High thermal conductivity for strong cooling performance

Composite superconductor material combining natural graphene and copper foil

Uniform heat dissipation from point to surface to avoid hotspot accumulation

Passive cooling with even planar heat distribution to accelerate heat dissipation

Electrically insulating and non-conductive

Self-adhesive backing for easy application

Increases heat dissipation area and speed, effectively lowering hotspot temperatures

Extends device lifespan by reducing thermal stress

Suitable for various electronic devices and cooling components

Can be freely cut to any size for DIY modifications and customized applications

Natural graphene

Copper foil

Protective paper backing

Avoid covering signal points on devices to prevent signal interference; cut out circular or square holes as needed