Ultra-low voltage starting at 1.25V; typical operation at 1.4V
Next-generation DDR5 architecture with doubled BANKGROUP to 8 banks
64-bit data bus split into two 32-bit channels for improved synchronous read/write efficiency
On-die ECC (Error Correction Code) for real-time error detection and correction, enhancing data integrity and stability
PMIC (Power Management Integrated Circuit) for intelligent voltage regulation and efficient power delivery, reducing motherboard power load and improving stability
Upgraded large aluminum alloy heat spreader with layered design and precise slot fitment for enhanced heat dissipation
Approximately 2mm thick aluminum alloy construction with high-density 3M thermal adhesive
Built-in temperature sensor for real-time thermal monitoring ensuring stable performance under high frequency
Compatible with major mainstream motherboard brands including ASUS, GIGABYTE, MSI
Supports Intel XMP 3.0 and AMD EXPO profiles for easy one-click overclocking
Stable dual-platform compatibility for both Intel and AMD systems
Recommended installation in dual-channel mode using matching color slots near CPU for optimal performance
BIOS update recommended for best compatibility and performance
Low latency and low voltage operation for high efficiency and fast CPU command response
Ideal for high-end gaming, AI computing, 4K video editing, 3D rendering, and multitasking workloads
Selected high-quality memory chips screened through automated processes to ensure overclocking potential and reliability
Additional details
Approximate size
134 mm (length) × 44 mm (height) × 7 mm (thickness)
Available colors
Glacier White / Metallic Gray
Intel XMP 3.0 certified
AMD EXPO supported
Product lifecycle warranty covering manufacturing, market supply, repair, and maintenance until end of product life
30 years brand heritage with global sales network and dedicated R&D centers
Actual product appearance may vary slightly from promotional images without affecting performance or usage
Performance and capacity may vary depending on system hardware and configuration
Product weight and packaging may differ by specification, capacity, and batch
For detailed chip selection, timing, and voltage information, please contact customer service
Manual measurements may have slight deviations; refer to actual product
Rigorous factory testing including high-temperature aging, chip screening, and simulated system stability tests to ensure high performance, quality, compatibility, and reliability
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