
Motherboard *1
Product Specifications
AMD Ryzen™ 7000/8000/9000 Series processors
Supports AMD Ryzen 9 9900X3D, 9950X3D, 9800X3D series processors
Compatible with 12-core AMD Ryzen 9 9900X3D CPU
Supports 11th Gen processors (partial mention)
Windows 11 Ready
18+2 phase (110A) power delivery design
Enhanced VRM cooling with direct-touch heat pipes and thermal pads
8-layer back-drilled PCB for signal purity and improved memory overclocking
Integrated VRM heatsink and reinforced heat pipe for stable power and thermal performance
Supports DDR5 memory with AI memory overclocking technology 2.0
Memory overclocking up to DDR5-9000+ MHz (dependent on memory and CPU capabilities)
Supports XMP/EXPO profiles for easy memory tuning
Memory capacity tested with 32GB (16GBx2) modules at 4800 MHz and 6000 MHz
Back-drilled PCB technology reduces signal interference for higher memory overclocking ceiling

X870
CN¥2,499.00

X870
CN¥3,299.00
1 x PCIe 5.0 x16 full-speed graphics card slot
2 x PCIe 5.0 M.2 slots
3 x PCIe 4.0 M.2 slots
Supports quick installation and removal of expansion cards
Front panel 65W PD Type-C charging port
Dual USB4 Type-C ports (40 Gbps)
Additional USB Type-C port (20 Gbps)
Multiple USB 3.2 Gen2 and Gen1 ports
Integrated Wi-Fi 7 with low latency for video conferencing and online gaming
Bluetooth 5.4 support
Wi-Fi antenna connector integrated into a single socket for easy installation
Flagship-grade cooling design with direct-touch heat pipes and thermal pads
Full coverage integrated heatsink backplate improving VRM and chipset cooling by 14%
SmartFan 6 technology for advanced fan control and system cooling optimization
Multiple M.2 slots with elastic backplate design supporting single and double-sided SSDs
M.2 Armor with magnetic attachment for quick heatsink installation
Latest BIOS supports AMD Ryzen 9000 series processors; BIOS update recommended for optimal performance
GIGABYTE X3D Turbo 2.0 software enables dynamic AI overclocking with three selectable modes (Max Performance, Balanced, Quiet) without entering BIOS
AI Overclocking tool for one-click DDR5 memory performance boost
EasyMode and AdvancedMode BIOS interfaces with Q-Flash+ and hardware reset buttons accessible from rear I/O panel
Pre-installed Wi-Fi drivers for plug-and-play network connectivity
Dual graphics card quick-release design for easy installation and removal
Front panel 65W fast charging Type-C port for mobile devices (requires compatible chassis)
RGB Fusion lighting with customizable AORUS armor lighting controlled via GIGABYTE Control Center (GCC)
Rear I/O panel includes power, reset, clear CMOS, and Q-Flash+ buttons for convenient system management
X3D Turbo Mode 2 delivers up to +25% gaming performance improvement compared to standard motherboards (tested internally)
Multi-threaded performance gains of +14% in Cinebench R24 MT benchmark with X3D Turbo Mode 2 enabled
Memory overclocking stability and performance validated through rigorous internal testing
Actual performance and features may vary depending on hardware configuration and BIOS version
Images and software interfaces are for reference only; actual product may differ
For best results, update to the latest BIOS version from GIGABYTE official website

Master Mini Board B650MF
CN¥669.00

B760
CN¥879.00