NVV Graphene Heat Dissipation Sheet Mobile Phone Thermal Conductive Cooling Pad High Nano Copper Foil Uniform Heat Spreader for Mobile Phone Assembly Computer Motherboard Cooling Device 100*200mm NZ-G

High thermal conductivity for strong cooling performance

Composite superconductor material combining natural graphene and copper foil

Uniform heat dissipation from point to surface to prevent hotspot accumulation

Passive cooling technology that accelerates heat dissipation and balances temperature

Self-adhesive backing for easy peel-and-stick application with strong adhesion and easy removal of protective paper

Customizable size with free cutting to fit various device requirements

Enhances device lifespan by lowering hotspot temperatures and improving heat spread

Suitable for DIY modifications and multiple usage scenarios

Natural Graphene

Copper Foil

Protective Paper (to be removed before use)

Avoid covering signal points on devices to prevent signal interference; cut out circular or square holes as needed

Long-term use without structural damage or performance degradation if not torn or damaged