SM2508, TSMC 6nm process, PCIe 5.0 controller with optimized power management and enhanced thermal control (38% temperature control improvement)
NAND Flash
Selected TLC 3D NAND with 8th generation NANDXtend error correction technology combining LDPC and RAID-like data redundancy for improved reliability and lifespan
Cache
Dynamic SLC cache plus 4GB independent DRAM cache for high-frequency data access and stable performance
Compatibility
Backward compatible with PCIe 4.0, supports Windows and Linux systems, plug and play
Form Factor
M.2 2280 dual-sided PCB design
Without heatsink
80 mm (L) x 22 mm (W) x 3 mm (H)
With heatsink
80 mm (L) x 24.5 mm (W) x 10 mm (H)
Without heatsink
~9 g
With heatsink
~35 g
Operating Temperature
0°C to 70°C
Storage Temperature
-40°C to 85°C
Mean Time Between Failures (MTBF)
1,600,000 hours
AI acceleration and ultra-durable architecture
Microsoft DirectStorage support for enhanced gaming experience and efficient CPU resource allocation
High performance for large game loading, 4K video editing, and 3D engineering files
Advanced power efficiency with up to 40x power efficiency improvement
Wide compatibility and easy installation for AI PC era large capacity storage needs
Additional details
Warranty
5-year limited warranty
Performance data based on FANXIANG laboratory tests; actual performance may vary depending on hardware and environment
Product appearance, software, and packaging may vary by shipment date and availability
Weight and specifications may vary by capacity and batch
Users are advised to back up personal data; FANXIANG is not responsible for data loss
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