Superior thermal conductivity ensures efficient heat transfer from CPU/GPU to heatsink, maintaining stable operating temperatures and extending device lifespan.
High-performance nano-scale spherical thermal conductive powder with smaller particle diameter for shorter conduction paths and enhanced thermal efficiency.
Stable performance with high insulation prevents electrical hazards and corrosion, ensuring safe use.
Excellent viscosity and density for easy and smooth application, filling microscopic gaps effectively to improve heat dissipation.
Designed for high-performance CPUs, GPUs, chipsets, and overclocking users requiring high thermal conductivity.
Long-lasting oil retention without using waste silicone oil, ensuring durability and consistent performance.
Does not increase temperature, only reduces it, guaranteeing reliable cooling.
Certified by authoritative bodies including SGS and VTCLA3, assuring product quality and consumer trust.
1. Clean the CPU surface thoroughly before application.
2. Apply a small, appropriate amount of thermal paste at the center of the CPU.
3. Use a spatula to spread the paste evenly and slowly with uniform thickness, avoiding air bubbles and excess paste overflow.
Thermal paste acts as a thermal interface material (TIM) to fill gaps between the CPU and heatsink, facilitating efficient heat transfer to maintain CPU temperature within a stable working range, preventing damage from overheating and prolonging electronic component lifespan.
Thermal conductivity is the amount of heat (in watts) transferred through a 1-meter thick material with a 1-degree temperature difference across its surfaces in one second, measured in W/(m·K). Higher thermal conductivity indicates better heat transfer performance under the same conditions.
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