Recommended for 13th Gen Intel CPUs (K series, non-F) and 700 series motherboards; supports Intel XMP 3.0 and AMD EXPO profiles
Overclocking
Supports manual overclocking with strong potential; XMP 3.0 enabled for easy overclocking
PCB
Thickened PCB with gold fingers for enhanced durability and stable compatibility
Thermal Solution
Dual-sided high-performance GPU-grade thermal grease pads on both sides of the memory chips and PCB; includes PMIC thermal pad for efficient heat dissipation
Error Correction
On-die ECC mechanism for real-time error detection and correction, ensuring stability at high frequencies and reducing CPU load
Power Management
Equipped with onboard PMIC power management chip for stable and efficient power delivery, enhancing overall system stability and overclocking reliability
High frequency of 6000MHz with low latency CL36 timing
Strictly hand-picked domestic chips for superior gaming and overclocking performance
Excellent compatibility with mainstream devices and platforms
Stable operation with enhanced anti-oxidation gold fingers
Designed for gamers and enthusiasts seeking breakthrough performance and reliability
Mixed shipment; actual product received may vary
Manual overclocking carries risks and should be attempted only by users with sufficient knowledge
Represents a significant technological advancement in domestic memory chip development and performance
Supports latest generation hardware and future-proof design