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BUBALUS T71 Dual Tower CPU Air Cooler (Reverse Gravity Pure Copper 7 Heat Pipes / Multi-Platform / Supports 1851/AM5 / PWM Intelligent Temperature Control / 12CM Dual Fans / CD Pattern Logo)
BUBALUS•radiator

BUBALUS T71 Dual Tower CPU Air Cooler (Reverse Gravity Pure Copper 7 Heat Pipes / Multi-Platform / Supports 1851/AM5 / PWM Intelligent Temperature Control / 12CM Dual Fans / CD Pattern Logo)

CNÂ¥149.00
SKU: 100264987093
Status:In Stock (3)
ID: 100048145129
Weight: 1078.00 g
Dims:213x165x160 mm

Specifications

Air-cooled base
Wearing piece process
Lighting Effects
No light
Compatible interface
INTEL LGA1700, INTEL LGA1851, AMD AM4, AMD AM5
Air-cooled base
heat pipe direct touch
Fan connection method
Wired connection
Number of heat pipes
7 heat pipe
Type
air-cooled radiator

Variants / Sale Attributes

Color: T71 (Dual Tower / 7 Heat Pipes / AMD / 1851)

Package Contents

1 x heatsink; 1 x accessory pack (including Intel bracket, thermal paste, etc.)

Product Description

Product Specifications

Overview

Brand
BUBALUS
Model
T71
Cooling Type
Air Cooling
Fan Size
120 mm
Fan Bearing Type
Dual Ball Bearing
Fan Speed
1000-2000 RPM ±10%
Maximum Airflow
85.7 CFM
Noise Level
≤36 dB(A)

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Rated Voltage
DC 12V
Rated Current
0.4A
Fan Connector
4-pin PWM
Heat Pipe Quantity
7
Heat Pipe Diameter
6 mm
Heat Pipe Material
Pure Copper (Blackened, Thickened)
Fin Material
Aluminum (0.4 mm Thickened, Blackened with Nano Coating)
Dimensions (L x W x H)
121 x 129 x 154 mm
Intel
LGA 115X / 1200 / 1366 / 1700 / 1851 (Supports Core 2 Duo, Core i3/i5/i7 series, Celeron, Pentium 4)
AMD
R9 950X3D / R7 9800X3D / AM4 / AM5 / Sempron / Athlon 64 / Athlon 2 / Phenom 64 / Ryzen R3, R5 series
Thermal Design Power (TDP)
≤230W

Blackened dual-tower heatsink with 7 pure copper heat pipes using reverse gravity technology for efficient heat transfer.

HDT (Heatpipe Direct Touch) technology with fine surface treatment for optimal thermal conductivity and oxidation resistance.

Nano spray coating on tower body for aesthetic black finish and enhanced durability.

Thickened aluminum fins (0.4mm) with press-fit fin technology for improved heat dissipation, reducing temperatures by 5-10°C.

High static pressure fan with CD pattern fan blades for strong airflow and enhanced cooling efficiency.

Dual ball bearing design extends fan lifespan and ensures stable long-term operation.

Easy-to-remove fan design for convenient cleaning and maintenance.

Offset heat pipe structure to avoid interference with tall memory modules, ensuring broad compatibility.

Multi-platform support including latest generation Intel and AMD CPUs.

Includes installation screwdriver and mounting accessories for Intel and AMD platforms (AMD platform requires motherboard original backplate).

1. Heatsink main body

2. Cooling fan

3. Intel backplate

4. Cable clip

5. Thermal paste

6. Plastic washers

7. Intel mounting screws

8. AMD mounting screws

9. Metal bracket

10. Screwdriver

Product information is for reference only; actual product may vary.

TDP values are based on BUBALUS laboratory testing; please refer to actual CPU TDP.

For CPU models not listed, please contact customer service for compatibility confirmation.

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