Built-in error correction technology improves data integrity and reduces CPU error correction load.
Thermal Design
Full metal heat spreader with clip-on installation tightly attached to PCB for enhanced heat dissipation and protection against dust and impact.
Multiple Specifications
Available in various frequencies (6000 MT/s, 6800 MT/s, 8000 MT/s), capacities (16GB, 24GB kits), and timings (C28, C30, C34, C36, C38, C40, C42).
Color Options
Available in red & black and red & white color schemes.
Architecture
DDR5 new generation architecture with dual 32-bit sub-channels, increased bank groups (up to 8), and total banks (32) for improved data transfer efficiency and reduced latency.
8000 MT/s, 16GB or 24GB x2, Timings
C36/C40, XMP 3.0
6800 MT/s, 16GB x2, Timings
C34/C38
6000 MT/s, 16GB or 24GB x2, Timings
C28, C30, C36, C42, XMP 3.0 / AMD EXPO
Read/write speeds are based on laboratory data and may vary depending on hardware, software, and environment.
Designed for new AMD and Intel platforms.
Provides stable, smooth user experience with robust build quality.
Competitive gaming
Artistic creation
High-performance computing
Please confirm specific model support and compatibility before purchase.