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BIWIN 24GB DDR5 6000MHz Desktop Memory Module Douzhan Xingzhe HX100 Heat Spreader (C30) Black AI PC Computer Storage Accessory

BIWIN 24GB DDR5 6000MHz Desktop Memory Module Douzhan Xingzhe HX100 Heat Spreader (C30) Black AI PC Computer Storage Accessory

CN¥2,499.00

SKU: 100321607582

Status:In Stock (22)

ID: 100321607582

Weight: 160.00 g

Dims:181x142x16 mm

Specifications

Total capacity: 24GB
Amount of memory: 1 piece
Appearance characteristics: vest strap
Platform: desktop computer memory
DDR algebra: DDR5
Memory frequency: 6000MHz

Variants / Sale Attributes

Memory frequency: 6000MHz C30 Battle Walker Black

Number of memory sticks and total capacity: 24GB, 1 piece

Package Contents

Memory module *1, instruction manual *1

Product Description

Overview

Brand: BIWIN

BIWIN HX100 DDR5 Gaming Memory Module

Official BIWIN genuine product; new and old versions of product appearance and packaging shipped randomly due to batch differences

Both versions have identical product functions, quality, and user experience

Awarded Red Dot Winner 2024

Designed for AMD Ryzen 9000 series processors with exclusive AMD platform optimization

Supports AMD AIPC technology

Additional details

Memory Type: DDR5 with Hynix M-Die chips
Frequency: 6000 MT/s
CAS Latency: CL30

Supports XMP and E.X.P.O profiles for easy one-click overclocking on dual platforms (AMD and Intel)

Triple heat dissipation architecture with aviation-grade aluminum heat spreader, CNC precision machining, high thermal conductivity silicone pads, and parallel groove design for +58.8% improved cooling efficiency

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Stable overclocking without signal loss

Compatible with AMD Ryzen 9000 series and various Intel platforms (detailed compatibility list below)

High-quality raw materials and refined packaging technology with strict laboratory testing

Product label is a warranty certificate; warranty void if label is damaged or lost

Additional details

Memory Capacity: (Not specified, please confirm)
Memory IC: Hynix M-Die (2GB/3GB variants depending on model)
Frequency: 6000 MT/s (also supports 6400 MT/s and 6800 MT/s variants depending on CPU and motherboard)
CAS Latency: 30 (CL30)
Rank: Single or Dual Rank depending on model
Overclocking: Supports AMD E.X.P.O and Intel XMP 3.0 profiles
Cooling: Triple heat dissipation with aviation-grade aluminum heat spreader and high thermal conductivity silicone pads
Compatibility: Supports AMD Socket AM5 (Ryzen 7000/9000 series) and Intel LGA1700, LGA1851, LGA 12th/13th/14th Gen Core processors with detailed motherboard compatibility (ASUS, MSI, GIGABYTE, ASRock models listed)
Warranty: Product life cycle warranty; label must be intact for warranty validity

BIWIN HX100 DDR5 Memory Module

Packaging box with user manual

Additional details

AMD Platforms: Socket AM5 motherboards including ASUS ROG STRIX B650E, MSI B650 M MORTAR, GIGABYTE B650, ASUS ROG CROSSHAIR X670E HERO/EXTREME, and X870/B850 chipsets
Intel Platforms: LGA1700, LGA1851 motherboards including ASUS PRIME Z690/Z790 series, MSI PRO Z690/Z790 series, GIGABYTE Z790/Z690 series, ASRock Z890/B860 series, supporting 12th, 13th, and 14th Gen Intel Core processors

Supports single and dual rank configurations with frequencies up to 8000 MT/s depending on CPU and motherboard support

Product appearance and packaging may vary between batches; both versions are official BIWIN products with identical performance

Ensure product label is preserved for warranty claims

Compatibility lists are for reference; actual support may vary depending on CPU IMC and motherboard BIOS updates

End of Specifications

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