18.5 mm x 8.5 mm x 73 mm (manual measurement, slight deviation possible)
Designed specifically for stacking and cascading in big data equipment
Reinforced design with wear and scratch resistance
Plug and play, stable with zero packet loss
Premium materials with precision craftsmanship
Electroplated hard gold plating for excellent heat dissipation and deformation resistance
Enhanced EMI/EMC performance
Silver-plated oxygen-free copper conductor reduces impedance for stable high-speed signal transmission
Thickened gold fingers and high-performance chips ensure low power consumption and reliable contact
High-performance, low latency, zero packet loss transmission
Additional details
Multi-layer shielding
foam insulation, 1 layer aluminum foil, 2 layers aluminum foil, metal braided mesh, PVC outer jacket for effective interference resistance
Zinc alloy shell with higher hardness than aluminum alloy, durable, anti-drop, wear-resistant, and heat dissipating
Low smoke, halogen-free outer jacket with reinforced strain relief design for extended durability and strong bending performance
Gold-plated contacts, zinc alloy housing, anti-bend SR design, pull ring latch, PVC jacket
Compact design with strict quality control for safe and stable connections
Broad compatibility with mainstream brands including ZTE, D-Link, H3C, Rugiest, CISCO, Huawei, Intel
Supports hot-swapping without driver installation or system warnings
Cost-effective alternative to active optical cables for short-distance wiring
Equivalent performance to 2x 10G optical modules plus 1x OM4 10G multimode fiber patch cable
Internal structure images are for illustration only; please refer to the actual product
Due to continuous updates in switches, routers, and high-speed network cards, compatibility issues may occur; please consult customer service before purchase for compatibility codes
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